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- Category: Uncategorized
- Category: News
- ASI Announces SoP-TM™
- American Semiconductor Demonstrates SoP-HEMI™ Spherical CHIPS for Ocular and Image Sensor Applications
- Why you should support the CHIPS Act
- American Semiconductor Is Taking A Step Towards U.S. Domestic Chip Packaging
- U.S. NDAA Initiates Renewal of Onshore Packaging, Assembly and Test
- ASI Wins Technical Development Manufacturing Award for 2019 at the IDTechEx Show!
- Our CEO, Doug Hackler, named Innovator of the Year for 2019 by Idaho Innovation Awards
- Semiconductor-on-Polymer Chip-Scale Packaging (SoP CSP)
- ASI Launches World’s First Fully Flexible, High Performance, Ultra-thin Bluetooth® IC
- ASI Wins FLEXI Best Product Innovation Award!
- HDM and ASI Announce JDA To Produce the World’s First High Reliability Ultra-Thin Packaged ICs
- KTVB Covers ASI Launch of the World’s First Smart Wine Bottle with A New Vintage Wine Shop
- ASI Launches the World’s First Smart Wine Bottle – Koenig Vineyards 2014 Cuvee Alden Private Reserve
- ASI Wins IoT Award for Best IoT Technology Development at IDTechEx 2018
- ASI and Molex announce demonstration of low-temp solder assembly capability for complex Flexible Hybrid Electronics
- NextFlex Lauds American Semiconductor as Game Changers in Flexible Hybrid Electronics Through Delivery of Flexible Smart Asset Monitor and Tracking Tag
- Category: Papers & Articles
- Protected Wafer Level Chip Scale Packaging (P-WLCSP)
- Advanced Protected Fan-In WLCSP
- Counterfeit Vaccines are proliferating and threaten to undermine the Covid-19 rollout
- Ultra-thin Flip-Chip Assembly for Heterogenous and Hybrid Integration
- Semiconductor-on-Polymer Wafer Level Chip Scale Packaging
- Flexible Hybrid Electronics (FHE) Assembly Using Low-Temp Solder on PET
- Category: Videos
- FleX-BLE Development Kit
- FleX NFC Starter Kit Video Guide
- Time Lapse of the World’s First Ultra-thin IC Production Line
- FleX-NFC Packaging Demo
- FleX NFC Lamination Demo
- FleX-NFC Datalogger Demo
- FleX-NFC Consumer Demo
- FleX-SOC Gesture Demo
- FleX-SOC with CDT Printed OLED Display
- FleX-NFC Wristbands
- FleX-NFC Demo
- FleX-SOC Demo
- Automated Printing for Flexible Hybrid Electronics
- Automated Overcoat for Flexible Hybrid Electronics
- FleXform-ADC with Printed Sensor
- FleXform-ADC Development Kit
- Category: Presentations
- Advanced IC Packaging & Assembly for AR/VR
- Advanced IC Packaging and Assembly for New Medical Capabilities
- P-WLCSP: 6-Side Protected WLCSP
- Advanced Protected Fan-In WLCSP
- Ultra-thin Flip-Chip Assembly for Heterogenous and Hybrid Integration
- Polymer Enabled Ultra-thin Package Solutions
- Revolutionary Tech for Thin Devices
- SEMICONDUCTOR-ON-POLYMER (SoP™) THE EVOLUTION OF THIN IC PACKAGING
- Ultra-Thin Wafer-Level Chip Scale Packaging
- Advanced Flexible Hybrid Electronic (FHE) Demonstrators
- Opportunities and Challenges for Thin MEMS Sensor System
- FHE System for Touch and Gesture
- Complex Flexible Hybrid Electronic Labels
- Flexible Smart Asset Monitor
- Advances in FHE Reliability – Flex
- Physically Flexible SoC
- Advances in FHE Reliability – Lopec
- System Design & Reliability
- Enabling Flexible Electronics
- FHE Integration & Manufacturing
- Advances in FHE Integration Using Flexform-ADC