American Semiconductor provides Test services for wafer, package and system level applications.
Digital and Mixed signal testing are available at wafer level for pre and post wafer level processing and packaging. This includes automated test capability for SoP post-packaging tape-on-frame. American Semiconductor can develop the probe-card hardware and test programs needed to provide functional testing before, during and after SoP packaging to meet customer requirements.
Test services are also available for post-assembly board level testing. This service is common to new product and low volume prototype programs.