ASI Launches World’s First Fully Flexible, High Performance, Ultra-thin Bluetooth® IC

Boise, ID, February 20, 2019

American Semiconductor, Inc. (ASI) today announced the launch of the new AS_NRF51822 FleX-BLE IC. The Semiconductor-on-Polymer chip scale packaged system on chip supports Bluetooth® Low Energy (BLE) communication. FleX-BLE is an ultra-thin and flexible SoP CSP version of Nordic Semiconductor’s nRF51822 Multiprotocol Bluetooth Low Energy/2.4 GHz RF System on Chip. This feature rich FleX-BLE product has an ARM® Cortex™ M0 processor, 256KB embedded Flash memory, 32KB RAM, encryption co-processor, temperature sensor, and 10-bit analog-to-digital converter. The FleX-BLE operates from 1.8-3.6V.

 SoP-TM™, the industry’s first wafer level CSP fully protected process has been released for customer use. The unique process features polyimide encasement on all 6 sides of the die. New product developments utilizing ultra-thin and/or flexible electronics have suffered for lack of the test chips needed to develop next generation advanced manufacturing processes. Thin, bare silicon is not sufficient for this requirement. 

Full function ICs are difficult to easily test and can be expensive to use for process development. Many new applications need chip scale packaged (CSP) ICs with full chip encapsulation for protection against damage and environmental exposure. American Semiconductor has released a new line-up of SoP-TM™ (6 side protected) CSP Test Chips that are designed for use in adoption of the new packaging technology.

These ultra-thin test chips include a variety of on-chip interconnects that enable quick and efficient testing of new assembly process capability. See the new Test Chips here.

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