ASI Launches World’s First Fully Flexible, High Performance, Ultra-thin Bluetooth® IC

Boise, ID, February 20, 2019

American Semiconductor, Inc. (ASI) today announced the launch of the new AS_NRF51822 FleX-BLE IC. The Semiconductor-on-Polymer chip scale packaged system on chip supports Bluetooth® Low Energy (BLE) communication. FleX-BLE is an ultra-thin and flexible SoP CSP version of Nordic Semiconductor’s nRF51822 Multiprotocol Bluetooth Low Energy/2.4 GHz RF System on Chip. This feature rich FleX-BLE product has an ARM® Cortex™ M0 processor, 256KB embedded Flash memory, 32KB RAM, encryption co-processor, temperature sensor, and 10-bit analog-to-digital converter. The FleX-BLE operates from 1.8-3.6V.

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