HDM and ASI Announce JDA To Produce the World’s First High Reliability Ultra-Thin Packaged ICs

Boise, ID, February 15, 2019

HD MicroSystemsTM (HDM) and American Semiconductor, Inc. (ASI) today announced the establishment of a joint development agreement to drive the adoption of ultra-thin chip packaging technology for both traditional rigid and emerging flexible electronics markets.  The joint development will leverage American Semiconductor’s patented Wafer-level Chip Scale Packaging technologies that are encapsulated with advanced polyimide materials provided by HD MicroSystemsTM. 

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