Boise, November 26, 2019
At the 16th IDTechEx Printed Electronics USA conference and exhibition held in Santa Clara on November 20-21, American Semiconductor was honored with the award for Technical Development Manufacturing. In 2019, American Semiconductor, Inc. (ASI) installed the world’s first advanced packaging facility for Semiconductor-on-Polymer™ (SoP) Chip Scale Package (CSP) manufacturing in Boise, Idaho. Click here to see our time lapse video.