San Jose, August 6, 2018
American Semiconductor and Molex have announced demonstration of low-temp solder assembly capability for complex Flexible Hybrid Electronics (FHE) systems by successfully attaching ultra-thin flexible integrated circuits (FleX-ICs), resistors and LEDs to printed Silver Flexible Circuits (SFCs). While others have demonstrated assembly of rigid test die and traditional packaged components to SFCs, American Semiconductor and Molex continue to lead innovation in manufacturing and assembly of truly thin and flexible systems without the traditional bulky components. The total thickness of the silver flexible circuit plus flexible IC is approximately 100µm.