Doug Hackler Read More
Papers & Articles
Protected Wafer Level Chip Scale Packaging (P-WLCSP)
Doug Hackler, Ed Prack PhD IMAPS 2022, Boston Read More
Advanced Protected Fan-In WLCSP
Doug Hackler, Ed Prack PhD IMAPS 2021 Read More
Counterfeit Vaccines are proliferating and threaten to undermine the Covid-19 rollout
American Semiconductor White PaperJanuary 2021 Download Content
Ultra-thin Flip-Chip Assembly for Heterogenous and Hybrid Integration
Douglas Hackler, Edward PrackIMAPS, 2020 Download Content
Semiconductor-on-Polymer Wafer Level Chip Scale Packaging
Douglas Hackler, Dale Wilson, Edward PrackDevice Packaging Conference, March 2019 Download Content