Papers & Articles

Protected Wafer Level Chip Scale Packaging (P-WLCSP)

Feb 14, 2023

Doug Hackler, Ed Prack PhD IMAPS 2022, Boston Read More

Advanced Protected Fan-In WLCSP

Sep 16, 2022

Doug Hackler, Ed Prack PhD IMAPS 2021 Read More

Counterfeit Vaccines are proliferating and threaten to undermine the Covid-19 rollout

Jan 22, 2021

American Semiconductor White PaperJanuary 2021 Download Content

Ultra-thin Flip-Chip Assembly for Heterogenous and Hybrid Integration

Aug 22, 2020

Douglas Hackler, Edward PrackIMAPS, 2020 Download Content

Semiconductor-on-Polymer Wafer Level Chip Scale Packaging

Mar 22, 2019

Douglas Hackler, Dale Wilson, Edward PrackDevice Packaging Conference, March 2019 Download Content

Flexible Hybrid Electronics (FHE) Assembly Using Low-Temp Solder on PET

Aug 22, 2018

Brian Meek, Dale WilsonWhite paper, August 2018 Download Content