U.S. NDAA Initiates Renewal of Onshore Packaging, Assembly and Test

Washington DC, January 1, 2021

A resurgence in U.S. semiconductor manufacturing began with the passage of the National Defense Authorization Act of 2021 (NDAA).  Provisions in NDAA Title XCIX authorize what could be billions of dollars of incentives for the construction and modernization of U.S. semiconductor facilities, including those for advanced packaging, assembly and testing.  Advanced packaging and related manufacturing is a key part of the semiconductor supply chain that occurs immediately following wafer fabrication. As wafer fab technical evolution, described as “Moore’s Law”, has slowed, advanced packaging concepts have moved to the forefront as the way to continue the evolution of semiconductor capability.   

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