U.S. NDAA Initiates Renewal of Onshore Packaging, Assembly and Test

Washington DC, January 1, 2021

A resurgence in U.S. semiconductor manufacturing began with the passage of the National Defense Authorization Act of 2021 (NDAA).  Provisions in NDAA Title XCIX authorize what could be billions of dollars of incentives for the construction and modernization of U.S. semiconductor facilities, including those for advanced packaging, assembly and testing.  Advanced packaging and related manufacturing is a key part of the semiconductor supply chain that occurs immediately following wafer fabrication. As wafer fab technical evolution, described as “Moore’s Law”, has slowed, advanced packaging concepts have moved to the forefront as the way to continue the evolution of semiconductor capability.   

 SoP-TM™, the industry’s first wafer level CSP fully protected process has been released for customer use. The unique process features polyimide encasement on all 6 sides of the die. New product developments utilizing ultra-thin and/or flexible electronics have suffered for lack of the test chips needed to develop next generation advanced manufacturing processes. Thin, bare silicon is not sufficient for this requirement. 

Full function ICs are difficult to easily test and can be expensive to use for process development. Many new applications need chip scale packaged (CSP) ICs with full chip encapsulation for protection against damage and environmental exposure. American Semiconductor has released a new line-up of SoP-TM™ (6 side protected) CSP Test Chips that are designed for use in adoption of the new packaging technology.

These ultra-thin test chips include a variety of on-chip interconnects that enable quick and efficient testing of new assembly process capability. See the new Test Chips here.

For more information contact us at here.

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