American Semiconductor Discusses Flexible Hybrid Electronics
Smaller packages are always better, right? And you can’t get smaller than the die itself, right? I mean, if you can attach a bare die directly onto a substrate of some sort, then you’re not dealing with any space overhead caused by a package. Techniques for doing this are referred to – unsurprisingly – as chip-scale packaging, or CSP, indicating that the final packaged product is roughly the size of the chip itself.