Future Opportunities – American Semiconductor Advanced Packaging (ASAP)
American Semiconductor in Boise is developing ultra-thin advanced packaging technology. The company currently maintains a pilot line for 200mm and 300mm processing supporting commercial and government contract manufacturing. We are working to respond to the newly passed National Defense Authorization Act (NDAA) that funds reshoring advanced packaging in the U.S. The goal of this effort is to create a new large-scale advanced packaging operation in the Boise area. We are working to determine the availability of packaging, assembly and test professionals to demonstrate project feasibility. The potential jobs that are associated with this project are contingent on final project approval. If you have experience in any of the following categories and are interested in discussing this potential opportunity, please fill out the form below.
- Advanced Packaging Engineers and Technicians
- Advanced Packaging Operations Management, Supervisors, Planners, Operators
- Advanced Packaging Quality and Reliability Manager, Engineers, Technicians
- Advanced Packaging Design Engineers