News

Boise, Idaho 1/6/2025 – American Semiconductor, Inc. (ASI), a leading innovator in advanced substrates, packaging and assembly, today announced it has been awarded a Small Business Innovation Research (SBIR) Phase II contract from the Defense Advanced Research...

Boise, ID (Feb. 18, 2025) — Advanced electronics manufacturing firm American Semiconductor (ASI) today announced certification to the latest ISO 9001 and ISO 13485 standards. The news highlights American Semiconductor’s quality management system (QMS) best practices...

SoP-TM™, the industry’s first wafer level CSP fully protected process has been released for customer use. The unique process features polyimide encasement on all 6 sides of the die. New product developments utilizing ultra-thin...

In another display of American innovation, American Semiconductor (ASI) demonstrated spherical IC assembly resulting from continued research and development of the U.S. company’s Semiconductor-on-Polymer WLCSP process. ASI is well known for making the thinnest ICs in...

I’m a conservative, free trader, committed capitalist and enthusiastic supporter of the CHIPS Act. Our ASAP team has worked for the last two years crafting and generating support for this legislation. CHIPS started as, and is, a highly bipartisan issue. Unfortunately,...

Widespread shortages of semiconductors over the last year have caused many people to focus on supply chain resilience, with calls to increase chip manufacturing in the U.S. The U.S. Innovation and Competition Act (USICA), which passed the Senate last June, proposes...

Washington DC, January 1, 2021 A resurgence in U.S. semiconductor manufacturing began with the passage of the National Defense Authorization Act of 2021 (NDAA).  Provisions in NDAA Title XCIX authorize what could be billions of dollars of incentives for the...

​Boise, November 26, 2019  At the 16th IDTechEx Printed Electronics USA conference and exhibition held in Santa Clara on November 20-21, American Semiconductor was honored with the award for Technical Development Manufacturing. In 2019, American...

Boise, October 30, 2019 Idaho Innovation Awards named American Semiconductor, Inc., CEO Doug Hackler, Innovator of the Year on Wednesday October 23, 2019.  The 14th annual Idaho Innovation Awards recognizes the innovations and entrepreneurs helping...

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Boise, ID, February 20, 2019 American Semiconductor, Inc. (ASI) today announced the launch of the new AS_NRF51822 FleX-BLE IC. The Semiconductor-on-Polymer chip scale packaged system on chip supports Bluetooth® Low Energy (BLE) communication. FleX-BLE is an ultra-thin...

Monterey, February 20, 2019  American Semiconductor, Inc. (ASI), the global leader in physically flexible integrated circuits called Semiconductor-on-Polymer (SoP) has been awarded the 2019 FLEXI award for Product Innovation by FlexTech today for ASI's new...

Boise, ID, February 15, 2019 HD MicroSystemsTM (HDM) and American Semiconductor, Inc. (ASI) today announced the establishment of a joint development agreement to drive the adoption of ultra-thin chip packaging technology for both traditional rigid and emerging...

Boise, ID January 7, 2019 - American Semiconductor launches the world’s first truly Smart Wine Bottle using American Semiconductor’s patented FleX™ technology. American Semiconductor is the global leader in physically flexible integrated circuits and Flexible Hybrid...

American Semiconductor launches the world’s first truly Smart Wine Bottle using American Semiconductor’s patented FleX™ technology. American Semiconductor is the global leader in physically flexible integrated circuits and Flexible Hybrid Electronics (FHE).

San Jose, November 14, 2018 American Semiconductor, Inc., the global leader in physically flexible integrated circuits and Flexible Hybrid Electronics (FHE), has been awarded Best Technology Development for the Internet of Things (IoT) in 2018 by IDTechEx today for...

San Jose, August 6, 2018 American Semiconductor and Molex have announced demonstration of low-temp solder assembly capability for complex Flexible Hybrid Electronics (FHE) systems by successfully attaching ultra-thin flexible integrated circuits (FleX-ICs), resistors...

San Jose, July 18, 2018 American Semiconductor, Inc., the global leader in physically flexible integrated circuits and Flexible Hybrid Electronics (FHE), has been honored by comments from NextFlex’s Director of Technology, Jason Marsh. “American Semiconductor’s...