Boise, October 30, 2019 Idaho Innovation Awards named American Semiconductor, Inc., CEO Doug Hackler, Innovator of the Year on Wednesday October 23, 2019. The 14th annual Idaho Innovation Awards recognizes the innovations and entrepreneurs helping...
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Semiconductor-on-Polymer Chip-Scale Packaging (SoP CSP)
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ASI Launches World’s First Fully Flexible, High Performance, Ultra-thin Bluetooth® IC
Boise, ID, February 20, 2019 American Semiconductor, Inc. (ASI) today announced the launch of the new AS_NRF51822 FleX-BLE IC. The Semiconductor-on-Polymer chip scale packaged system on chip supports Bluetooth® Low Energy (BLE) communication. FleX-BLE is an ultra-thin...
ASI Wins FLEXI Best Product Innovation Award!
Monterey, February 20, 2019 American Semiconductor, Inc. (ASI), the global leader in physically flexible integrated circuits called Semiconductor-on-Polymer (SoP) has been awarded the 2019 FLEXI award for Product Innovation by FlexTech today for ASI's new...
HDM and ASI Announce JDA To Produce the World’s First High Reliability Ultra-Thin Packaged ICs
Boise, ID, February 15, 2019 HD MicroSystemsTM (HDM) and American Semiconductor, Inc. (ASI) today announced the establishment of a joint development agreement to drive the adoption of ultra-thin chip packaging technology for both traditional rigid and emerging...
KTVB Covers ASI Launch of the World’s First Smart Wine Bottle with A New Vintage Wine Shop
Boise, ID January 7, 2019 - American Semiconductor launches the world’s first truly Smart Wine Bottle using American Semiconductor’s patented FleX™ technology. American Semiconductor is the global leader in physically flexible integrated circuits and Flexible Hybrid...