SoP-TM™, the industry’s first wafer level CSP fully protected process has been released for customer use. The unique process features polyimide encasement on all 6 sides of the die. New product developments utilizing ultra-thin and/or flexible electronics have...
News
American Semiconductor Demonstrates SoP-HEMI™ Spherical CHIPS for Ocular and Image Sensor Applications
In another display of American innovation, American Semiconductor (ASI) demonstrated spherical IC assembly resulting from continued research and development of the U.S. company’s Semiconductor-on-Polymer WLCSP process. ASI is well known for making the thinnest ICs in...
Why you should support the CHIPS Act
I’m a conservative, free trader, committed capitalist and enthusiastic supporter of the CHIPS Act. Our ASAP team has worked for the last two years crafting and generating support for this legislation. CHIPS started as, and is, a highly bipartisan issue. Unfortunately,...
American Semiconductor Is Taking A Step Towards U.S. Domestic Chip Packaging
Widespread shortages of semiconductors over the last year have caused many people to focus on supply chain resilience, with calls to increase chip manufacturing in the U.S. The U.S. Innovation and Competition Act (USICA), which passed the Senate last June, proposes...
U.S. NDAA Initiates Renewal of Onshore Packaging, Assembly and Test
Washington DC, January 1, 2021 A resurgence in U.S. semiconductor manufacturing began with the passage of the National Defense Authorization Act of 2021 (NDAA). Provisions in NDAA Title XCIX authorize what could be billions of dollars of incentives for the...
ASI Wins Technical Development Manufacturing Award for 2019 at the IDTechEx Show!
Boise, November 26, 2019 At the 16th IDTechEx Printed Electronics USA conference and exhibition held in Santa Clara on November 20-21, American Semiconductor was honored with the award for Technical Development Manufacturing. In 2019, American...