News

ASI Announces SoP-TM™

SoP-TM™, the industry’s first wafer level CSP fully protected process has been released for customer use. The unique process features polyimide encasement on all 6 sides of the die. New product developments utilizing ultra-thin and/or flexible electronics have...

Why you should support the CHIPS Act

I’m a conservative, free trader, committed capitalist and enthusiastic supporter of the CHIPS Act. Our ASAP team has worked for the last two years crafting and generating support for this legislation. CHIPS started as, and is, a highly bipartisan issue. Unfortunately,...

U.S. NDAA Initiates Renewal of Onshore Packaging, Assembly and Test

Washington DC, January 1, 2021 A resurgence in U.S. semiconductor manufacturing began with the passage of the National Defense Authorization Act of 2021 (NDAA).  Provisions in NDAA Title XCIX authorize what could be billions of dollars of incentives for the...