Multi-Project Substrate (MPS) Program
Ultraflex™ and Nobleflex™ High Density Interconnect Substrates (HDIS)
The American Semiconductor (ASI) Multi-Project Substrate Program provides HDIS users the ability to acquire low-cost state-of-the-art samples of their designs to validate and evaluate electronic concepts for new multi-component applications requiring fine feature interconnects and/or physical flexibility. Organic high density electronic substrate materials are typically a polymer or a resin, used as a foundation for building electronic components. HDIS provides a platform for creating circuits, supporting the placement of other components, and enabling electrical connections. HDIS are crucial for the functionality and reliability of electronic devices that require high density interconnections between high pin-count devices such as ICs, SOC, and chiplets.
Ultraflex is a copper on polyimide (Cu-on-PI) HDI Substrate. Ultraflex can be compared to both substrate and flexible PCB (FPCB) commonly offered as “flex”. Ultraflex is currently offered as a 2-layer Cu-on-PI polyimide build-up substrate with 1 um minimum feature sizes. Ultraflex provides a state-of-the-art capability for multi-chip modules, heterogeneous integration, 3D integration, and similar applications.
Nobleflex is a gold on polyimide (Au-on-PI) HDI Substrate. Nobleflex can be compared to both substrate and flexible PCB (FPCB) using noble metals such as gold and platinum (Pt). Nobleflex is currently offered as a 2-layer Au-on-PI polyimide build-up substrate. Nobleflex provides an advanced capability that is highly applicable to medical devices. This type of substrate is common to advanced BCI, catheter, implant, and wearable applications.
ASI supports utilization of Ultraflex and Nobleflex with Chip-on-Flex (CoF) assembly and can provide ultra-thin advanced chip packaging enabling ICs to be as thin and flexible as the HDI substrates they can be assembled on.
How the MPS Program Works:
ASI offers Ultraflex and Nobleflex substrates as a contract manufacturing service in a manner very similar to the way that foundries provide wafer fabrication services. MPS is easily compared to multiproject wafer offerings. ASI MPS lots run on an established schedule and contain multiple customer designs on each substrate. When the lot is complete, ASI singulates the substrates in the lot and provides each customer’s specific design to only the customer that subscribed to the MPS run.
Ultraflex and Nobleflex design rules are provided to customer that wish to create designs for their MPS. The areas used for each customer is typically described as a coupon. Standard coupons are 20x65mm and can contain any customer design(s) a customer creates within the limits of the design rules. Standard pricing is provided for standard size coupons and MPS run schedules will be posted periodically
on the ASI website: americansemi.com. Non-standard size coupons and full-substrate offerings are available and can be quoted on request. Custom metal and polymer materials may be considered for customer specific project.
Contact sales@americansemi.com For more information on ASI MPS substrates. Process architecture details, design rules and pricing are available with placement of an NDA.