American Semiconductor introduces Nobleflex™ and Ultraflex™ advanced substrates and FPCBs with features at 1um.
Services & Products
American Semiconductor’s advanced packaging technology and services provide thin capabilities. ASI’s offerings include Semiconductor-on-Polymer™ chip scale packaging, chip-on-flex assembly and a wide variety of engineering and design services. See List of Services & Products below.
Advanced Substrates
Advanced Packaging
Assembly & Test
