Who We Are
About Us
American Semiconductor serves the semiconductor and related industries as the leading developer and manufacturer of ultra-thin chip technology and manufacturing. The company invented and supplies Semiconductor-on-Polymer (SoP) wafer level chip scale packaging (WLCSP) for thin device applications that include, but are not limited to, chip-on-flex, protected fan-in, heterogeneous integration and multi-chip packaging. The company provides design, assembly, test and custom engineering services for thin-device technology. As an advanced packaging and assembly provider, American Semiconductor enables reliable high efficiency advanced packaging, assembly and test of thin electronics. Headquartered in Boise, Idaho, American Semiconductor operates a 9,000 square foot facility housing WLCSP fabrication, assembly and test operations.
What We Do
We are the semiconductor manufacturing service provider that specializes in development and production of thin substrates, IC packaging and chip-on-flex assembly. American Semiconductor (ASI) thin-device capability is based on Semiconductor-on-Polymer™ packaging that makes the thinnest devices and semiconductor substrates possible. ASI is a global provider of a complete range of services for thin electronic system manufacturing. Our extensive expertise, capabilities, and facilities enable us to support your program requirements for new product development and volume manufacturing.