by American Semiconductor | Sep 10, 2022
FleX-C & SoP-TM ICs Small quantity thin-device availability can be challenging for new projects. American Semiconductor maintains an inventory of SoP packaged ICs that can be used for product development, evaluations and feasibility projects. Current inventory...
by American Semiconductor | Sep 9, 2022
FleX-BLE Dev Kit SoP packaging makes the thinnest Bluetooth systems possible. Bluetooth® capability is desirable for trackers, headsets, beacons, virtual reality, medical monitors and many other applications too numerous to list. In most cases, making this capability...
by American Semiconductor | Sep 8, 2022
FleX-ADC Development Kit The FleXform-ADC is the world’s first complete development kit for flexible hybrid electronics. The FleXform-ADC is designed for developing and prototyping printed and/or flexible sensors integrated with physically flexible FleX-ICs. The...
by jordan@brandcraft.com | Sep 7, 2022
FleX-NFC Starter Kit The FleX-NFC Starter Kit provides an out-of-the-box demonstration of FHE feasibility and will enable you to create your own Flexible Hybrid Electronics (FHE) systems. In this Flex-NFC Starter Kit, you can find the following items: Three (3)...
by American Semiconductor | Aug 23, 2022
Smart Tags Smart tags are labels that do not require any on-board power source. American Semiconductor is not a smart tag company. However, SoP packaged ICs and flip-chip ACA thin device assemblies have been demonstrated as ideal for smart label applications. American...
