by Webmaster_ASI | Sep 16, 2022 | Papers & Articles
Doug Hackler, Ed Prack PhD IMAPS 2021 Read More
by Webmaster_ASI | Sep 15, 2022
Site Map Pages About Careers Account Manager Lead Hardware Engineer History Who We Are Contact Us Downloads – FleX-ADC Development Kit Downloads – FleX-BLE Dev Kit Downloads – FleX-ICs: Semiconductor-on-Polymer Products Downloads – FleX-NFC...
by American Semiconductor | Sep 14, 2022
Design & Integration American Semiconductor provides Design and Integration services for Flexible Hybrid Electronics including: Flexible Circuit Board (FCB) Design & Layout IC design support (specific to new pad layouts and optimization for packaging) FCB...
by American Semiconductor | Sep 13, 2022
Semiconductor-on-Polymer™ Chip Scale Packaging Semiconductor-on-Polymer (SoP™) Protected-WLCSP, aka P-WLCSP, is an advanced CSP process for 200mm and 300mm wafers. The FleX-C SoP process can be used to protect two sides of the die. The SoP-TM process can fully encase...
by American Semiconductor | Sep 12, 2022
Assembly American Semiconductor provides Assembly services for SoP, thin-device technology, and SMT supporting product development and pilot production volumes.American Semiconductor ACA Flip-chip assembly is a high-density anisotropic conductive adhesive “direct...