by Seth Leija | Mar 10, 2023 | News
SoP-TM™, the industry’s first wafer level CSP fully protected process has been released for customer use. The unique process features polyimide encasement on all 6 sides of the die. New product developments utilizing ultra-thin and/or flexible electronics have...
by Seth Leija | Feb 14, 2023 | Papers & Articles
Doug Hackler, Ed Prack PhD IMAPS 2022, Boston Read More
by Seth Leija | Nov 14, 2022 | News
In another display of American innovation, American Semiconductor (ASI) demonstrated spherical IC assembly resulting from continued research and development of the U.S. company’s Semiconductor-on-Polymer WLCSP process. ASI is well known for making the thinnest ICs in...
by Webmaster_ASI | Sep 16, 2022 | Papers & Articles
Doug Hackler, Ed Prack PhD IMAPS 2021 Read More
by Webmaster_ASI | Sep 15, 2022
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