Assembly

Assembly

Assembly American Semiconductor provides Assembly services for SoP, thin-device technology, and SMT supporting product development and pilot production volumes.American Semiconductor ACA Flip-chip assembly is a high-density anisotropic conductive adhesive “direct...
Wafer Test

Wafer Test

Wafer Test ​American Semiconductor provides Test services for wafer, package and system level applications. Digital and Mixed signal testing are available at wafer level for pre and post wafer level processing and packaging. This includes automated test capability for...
System & Reliability Testing

System & Reliability Testing

Flex Assembly Testing Chip-on-flex – SoP/SMT on board testing FHE – Flexible Hybrid System Function and Reliability Chip-on-flex and FHE systems require evaluation to ensure manufacturing methods and that functional products are being shipped to customers....
FleX-ICs: Semiconductor-on-Polymer Products

FleX-ICs: Semiconductor-on-Polymer Products

FleX-ICs: Semiconductor-on-Polymer Chips ​Small quantity thin-device availability can be challenging for new projects. American Semiconductor maintains an inventory of SoP packaged ICs that can be used for product development, evaluations and feasibility projects....
Thin and Flexible Bluetooth™ Development Kit

Thin and Flexible Bluetooth™ Development Kit

FleX-BLE Dev Kit SoP packaging makes the thinnest Bluetooth systems possible. Bluetooth® capability is desirable for trackers, headsets, beacons, virtual reality, medical monitors and many other applications too numerous to list. In most cases, making this capability...