In another display of American innovation, American Semiconductor (ASI) demonstrated spherical IC assembly resulting from continued research and development of the U.S. company’s Semiconductor-on-Polymer WLCSP process. ASI is well known for making the thinnest ICs in...
American Semiconductor Discusses Flexible Hybrid Electronics Smaller packages are always better, right? And you can’t get smaller than the die itself, right? I mean, if you can attach a bare die directly onto a substrate of some sort, then you’re not dealing with any...
