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Revolutionary Tech for Thin Devices

Revolutionary Tech for Thin Devices

by American Semiconductor | Jan 8, 2020 | Presentations

CES 2020 Fill out this form to get access to your download. Full Name(Required) First Email Address(Required) Phone Number...

ASI Wins Technical Development Manufacturing Award for 2019 at the IDTechEx Show!

by American Semiconductor | Nov 26, 2019 | News

​Boise, November 26, 2019  At the 16th IDTechEx Printed Electronics USA conference and exhibition held in Santa Clara on November 20-21, American Semiconductor was honored with the award for Technical Development Manufacturing. In 2019, American...

Our CEO, Doug Hackler, named Innovator of the Year for 2019 by Idaho Innovation Awards

by American Semiconductor | Oct 30, 2019 | News

Boise, October 30, 2019 Idaho Innovation Awards named American Semiconductor, Inc., CEO Doug Hackler, Innovator of the Year on Wednesday October 23, 2019.  The 14th annual Idaho Innovation Awards recognizes the innovations and entrepreneurs helping...
SEMICONDUCTOR-ON-POLYMER (SoP™) THE EVOLUTION OF THIN IC PACKAGING

SEMICONDUCTOR-ON-POLYMER (SoP™) THE EVOLUTION OF THIN IC PACKAGING

by American Semiconductor | Oct 1, 2019 | Presentations

IWLPC 2019 Fill out this form to get access to your download. Full Name(Required) First Email Address(Required) Phone Number...
Ultra-Thin Wafer-Level Chip Scale Packaging

Ultra-Thin Wafer-Level Chip Scale Packaging

by American Semiconductor | Oct 1, 2019 | Presentations

IMAPS 2019 Boston Fill out this form to get access to your download. Full Name(Required) First Email Address(Required) Phone Number...
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